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WDS-750 Laptop BGA Machine

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Shenzhen Wisdomshow Technology Co.,ltd

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MOQ : 1unit

Price : USD 8000-9500/unit

Payment Terms : L/C, D/P, T/T, Western Union

Supply Ability : 200 units/month

Delivery Time : 5-7 working days

Packaging Details : wooden package

Product Name : Laptop BGA Machine

Model No. : WDS-750

Power : 6800W

Power supply : AC 220V±10 50Hz

IR heater power : 4200W(2400W control)

Material : High sensitive touch screen+temperature control module+PLC+step drive

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Specification and Feature:

Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement

High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter:

Power	6800W
Up heater power	1200W
Down heater power	1200W
IR heater power	4200W(2400W control)
Power supply	(Single Phase) AC 220V±10 50Hz
Position way	Optical lens+ Vshape holder+laser positioning
Temperature control	High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material	High sensitive touch screen+temperature control module+PLC+step drive
PCB Size	Max:500×450mm , Min: 10×10mm
Thermo-couple Ports	4pcs
Chips magnification times	2-30
PCB thickness	0.5-8mm
GA size	0.8mm-8cm
Min.chips pitch	0.15mm
Mounting BGA weight	1000G
Mounting precision	±0.01mm
Overall dimension	L670×W780×H850mm
Optical alignment lens	Motor drive can move front back right left
Weight of machine	About 90kg

Product Tags:

6800W 220V Laptop BGA Machine

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